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    C624A16T

    Dual Socket P Intel® Xeon, 10 SATA3-6, 2 Gigabit LAN, 16 DDR4 up to 2TB, 7 Slots

    [] Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported.
    [] Intel® C624
    []  Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
    []  3 PCI-E 3.0 x16,4 PCI-E 3.0 x8,M.2 Interface: 2 PCI-E 3.0 x4,M.2 Form Factor: 22110,M.2 Key: M-Key (RAID 0,1 support)
    []  1 VGA port
    []  Intel® C624 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    []  Dual LAN with 10GBase-T with Intel® X557

    Call for pricing(800-999-1278)
    SKU: C624A16T
    Product specifications
    Processor
    • Intel® Xeon® Scalable Processors
    • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
    • CPU1: Skylake-F CPU supported.
    Chipset Intel® C624
    Memory
    • Up to 2TB DDR4-2666MHz Memory in 16 DIMM slots
    • Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIM
    On-Board Devices
    • 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    • IPMI
    • Dual LAN with 10GBase-T with Intel® X557
    Expansion
    • 3 PCI-E 3.0 x16,
    • 4 PCI-E 3.0 x8
    • M.2 : 2 PCI-E 3.0 x4
    I/O Ports
    • 10 SATA3 (6Gbps) ports
    • 2 RJ45 10GBase-T ports
    • 7 USB 3.0 ports (4 rear + 2 headers + 1 Type A)
    • 1 VGA port
    • 2 COM Ports (1 rear, 1 header)
    • TPM Header
    Systemboard
    E-ATX 12" x 13"
    Chassis 2U chassis:
    • Dimensions: 17.2" (437mm) x 3.5" (89mm) x 25.5" (648mm)
    • Weight: 52 lbs (23.6kg)
    • 740W (1+1) Redundant high-efficiency power supply with PMBus
    BIOS AMI UEFI
    Environment
    • Operating Temperature: 0 to +55 C
    • Non operating temperature: -20 to +70 C
    • Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
    • Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
    • Shock - Operating: 3,920 m/s2 (400G) 2ms
    • Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
    • Operating Relative Humidity: 8% to 90% (non-condensing)
    • Non-operating Relative Humidity: 5% to 95% (non-condensing)
    • MTBF: 50,000 Hours
    • RoHS Compliance
    Product specifications
    Processor
    • Intel® Xeon® Scalable Processors
    • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s
    • CPU1: Skylake-F CPU supported.
    Chipset Intel® C624
    Memory
    • Up to 2TB DDR4-2666MHz Memory in 16 DIMM slots
    • Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIM
    On-Board Devices
    • 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
    • IPMI
    • Dual LAN with 10GBase-T with Intel® X557
    Expansion
    • 3 PCI-E 3.0 x16,
    • 4 PCI-E 3.0 x8
    • M.2 : 2 PCI-E 3.0 x4
    I/O Ports
    • 10 SATA3 (6Gbps) ports
    • 2 RJ45 10GBase-T ports
    • 7 USB 3.0 ports (4 rear + 2 headers + 1 Type A)
    • 1 VGA port
    • 2 COM Ports (1 rear, 1 header)
    • TPM Header
    Systemboard
    E-ATX 12" x 13"
    Chassis 2U chassis:
    • Dimensions: 17.2" (437mm) x 3.5" (89mm) x 25.5" (648mm)
    • Weight: 52 lbs (23.6kg)
    • 740W (1+1) Redundant high-efficiency power supply with PMBus
    BIOS AMI UEFI
    Environment
    • Operating Temperature: 0 to +55 C
    • Non operating temperature: -20 to +70 C
    • Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz
    • Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz
    • Shock - Operating: 3,920 m/s2 (400G) 2ms
    • Shock - Non-Operating: 8,820 m/s2 (900G) 1ms
    • Operating Relative Humidity: 8% to 90% (non-condensing)
    • Non-operating Relative Humidity: 5% to 95% (non-condensing)
    • MTBF: 50,000 Hours
    • RoHS Compliance
    Product tags