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Picture of C624A16T

Picture of C624A16T

Picture of C624A16T

C624A16T

Dual Socket P Intel® Xeon, 10 SATA3-6, 2 Gigabit LAN, 16 DDR4 up to 2TB, 7 Slots

Featured Highlights
•	Intel® Xeon® Scalable Processors., Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported.
•	Intel® C624
•	Up to 2TB 3DS ECC RDIMM, DDR4-2666MHz; Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
•	3 PCI-E 3.0 x16,4 PCI-E 3.0 x8,M.2 Interface: 2 PCI-E 3.0 x4 M.2 Form Factor: 22110,M.2 Key: M-Key (RAID 0,1 support)
•	1 VGA port
•	Intel® C624 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
•	5 USB 3.0 ports, 4 USB 2.0 ports

SKU: C624A16T

Specifications
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Product specifications

Processor • Intel® Xeon® Scalable Processors • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s • CPU1: Skylake-F CPU supported. Chipset Intel® C624
Memory • Up to 2TB DDR4-2666MHz Memory in 16 DIMM slots • Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIM On-Board Devices • 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 • IPMI • Dual LAN with 10GBase-T with Intel® X557
Expansion • 3 PCI-E 3.0 x16, • 4 PCI-E 3.0 x8 • M.2 : 2 PCI-E 3.0 x4 I/O Ports • 10 SATA3 (6Gbps) ports • 2 RJ45 10GBase-T ports • 7 USB 3.0 ports (4 rear + 2 headers + 1 Type A) • 1 VGA port • 2 COM Ports (1 rear, 1 header) • TPM Header
Systemboard • E-ATX 12" x 13" Chassis 2U chassis: • Dimensions: 17.2" (437mm) x 3.5" (89mm) x 25.5" (648mm) • Weight: 52 lbs (23.6kg) • 740W (1+1) Redundant high-efficiency power supply with PMBus
BIOS AMI UEFI Environment • Operating Temperature: 0 to +55 C • Non operating temperature: -20 to +70 C • Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz • Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz • Shock - Operating: 3,920 m/s2 (400G) 2ms • Shock - Non-Operating: 8,820 m/s2 (900G) 1ms • Operating Relative Humidity: 8% to 90% (non-condensing) • Non-operating Relative Humidity: 5% to 95% (non-condensing) • MTBF: 50,000 Hours • RoHS Compliance

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Product specifications

Processor • Intel® Xeon® Scalable Processors • Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 3 UPI up to 10.4 GT/s • CPU1: Skylake-F CPU supported. Chipset Intel® C624
Memory • Up to 2TB DDR4-2666MHz Memory in 16 DIMM slots • Memory Type 2666/2400/2133MHz ECC DDR4 RDIMM, LRDIM On-Board Devices • 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 • IPMI • Dual LAN with 10GBase-T with Intel® X557
Expansion • 3 PCI-E 3.0 x16, • 4 PCI-E 3.0 x8 • M.2 : 2 PCI-E 3.0 x4 I/O Ports • 10 SATA3 (6Gbps) ports • 2 RJ45 10GBase-T ports • 7 USB 3.0 ports (4 rear + 2 headers + 1 Type A) • 1 VGA port • 2 COM Ports (1 rear, 1 header) • TPM Header
Systemboard • E-ATX 12" x 13" Chassis 2U chassis: • Dimensions: 17.2" (437mm) x 3.5" (89mm) x 25.5" (648mm) • Weight: 52 lbs (23.6kg) • 740W (1+1) Redundant high-efficiency power supply with PMBus
BIOS AMI UEFI Environment • Operating Temperature: 0 to +55 C • Non operating temperature: -20 to +70 C • Vibration - Operating: 9.8 m/s2(1.0G) 5 to 500Hz • Vibration - Non operating: 49 m/s2(5.0G) 15 to 500Hz • Shock - Operating: 3,920 m/s2 (400G) 2ms • Shock - Non-Operating: 8,820 m/s2 (900G) 1ms • Operating Relative Humidity: 8% to 90% (non-condensing) • Non-operating Relative Humidity: 5% to 95% (non-condensing) • MTBF: 50,000 Hours • RoHS Compliance

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fanless (25)